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Dr. Donahoe has 30 years of experience related to electronics integration and reliability. His electronic packaging analysis skills include thermal analysis, stress and dynamics analysis, and component failure analysis. At Exponent, Dr. Donahoe has worked on computer products, medical products, industrial equipment, consumer products, petrochemical equipment, automotive equipment, and solar energy systems. Electronics work at Exponent has included component failure analysis of components such as the printed wiring board, capacitor, inductor, diode, cold cathode fluorescent lamp, and other common components. Solution methods have included reliability analyses such as fishbone diagrams and failure modes and effects analysis (FMEA), finite element analysis (FEA), and laboratory testing. Other tasks have included intellectual property.
Prior to joining Exponent, his functional assignments included work as a design engineer, reliability engineer, thermal engineer, manager, technologist, and scientist. In military electronics, he worked on electronics exposed to extreme environments ranging from the high acceleration loads of gun launch to thermal challenges faced in life support, spacecraft, and the design of high voltage radar subsystems. In addition to electronic products exposed to exotic environments, Dr. Donahoe has worked on cost-driven commercial electronics products. His work on cooling of computer components has generated patents. In addition, Dr. Donahoe has worked on electronics into facilities, especially focusing on the design of Heating, Ventilation, and Air Conditioning (HVAC) support systems.
Dr. Donahoe is the 2007–2008 Chair of the IEEE Components, Packaging and Manufacturing Technologies Society (CPMT) Santa Clara Valley Chapter.
Donahoe D. Engineers Week: How things have changed since 1952. Utah Engineers Council Journal, pp. 30–35, February 2007.
Donahoe D, Pecht M, Lloyd I, Ganesan S. Moisture induced degradation of multilayer ceramic capacitors. Journal of Microelectronics Reliability 2006; 46(2-4):400–408, February–April.
Donahoe D, Pecht M. New aging mechanism in multilayer ceramic capacitors. Advanced Packaging Magazine, June 2005.
Donahoe D. Moisture in multilayer ceramic capacitors. Ph.D. Thesis, University of Maryland at College Park, January 2005.
Donahoe D, Pecht M. Are U.S. jobs moving to China? IEEE Transactions on Components and Packaging Technologies, pp. 682–686, September 2003.
Donahoe D, Hillman C, Pecht M. Failures in Base Metal Electrode (BME) capacitors. 23rd Annual CARTS Proceedings, pp. 129–133, April 2, 2003.
Cartwright J, Donahoe D, Jackson M. Reliability and assessment of electronic systems and equipment. IEEE Transactions on Components and Packaging Technologies, pp. 127–128, March 1999.
Donahoe D. Bedrock of electronics. Mechanical Engineer, pp. 62–63, November 1986.
Meyer A, Hanson K, Donahoe D. CERDIPS as gun rugged artillery fuze components. ASME Winter Annual Meeting, November 1984.
Donahoe D. A computer model of a campus building. M.S. Thesis, University of Illinois at Urbana-Champaign, May 1979.
Donahoe D, Mair S, Bloomberg G, Nelson D. Energy survey—reduction of energy conservation. B.S. Thesis, University of Illinois at Urbana-Champaign, May 1977.
Book Chapters
Donahoe D, Zhao K, Murray S, Ray R. Accelerated life testing. Wiley Encyclopedia of Quantitative Risk Assessment, in press.
Vijayaragavan N, Donahoe D, Pecht M. Determination of the life cycle environment. In: China's Electronic Industry, Chapter 12. Pecht M (ed), Wiley-Interscience, pp. 145-170, Hoboken, NJ, 2004.
Wu J, Haiyu Q, Donahoe D. China's electronic manufacturing services. In: China's Electronic Industry, Chapter 6. Pecht M, Chan Y (eds), CALCE Press, College Park, MD, pp. 261-275, 2003.
Donahoe D. The transition of electronics to China. In: China's Electronic Industry, Chapter 13. Pecht M, Chan Y (eds), CALCE Press, pp. 261-275, College Park, MD, 2004.
Presentations
Donahoe D. The rocky marriage of technology and quality, how technological maturity drives quality both up and down. ASQ Golden Gate Section, Jack London Square, February 19, 2008.
Donahoe D. Running a successful Chapter. IEEE/Santa Clara Valley Section 2007 Officer Training, January 20, 2007.
Donahoe D, Poliskie M. Economics of technology and the engineering career. Joint meeting of the IEEE CPMT Santa Clara Valley Chapter and IEEE GOLD, Sunnyvale, April 12, 2006 and IEEE CPMT San Jose State University Chapter, April 26, 2006.
Donahoe D, Fasching-James A. RoHS: 1 of 6, Eutectic Tin-Lead solder is one of 6 prohibited substances. ASME Santa Clara Valley Section, Menlo Park, CA, April 20, 2006.
Donahoe D. Drift in multilayer ceramic capacitors. IEEE CPMT Santa Clara Valley Chapter, Sunnyvale, CA, February 8, 2006.
Donahoe D, Ganesan S, Pecht M. Connect with and strengthen your supply chain. NEMI Sensor Technology Working Group, Herndon, VA, June 23, 2004.
Donahoe D, Pecht M. Risks to off-shoring strategic electronic parts. IMAPS, Baltimore, March 28, 2004.
Donahoe D, Ramahi O, Pecht M. Fighting the war in the airwaves. IMAPS, Baltimore, MD, March 12–14, 2003.
Donahoe D. Finance, physics and capacitors. IPC Chesapeake Chapter, College Park, MD, January 2003.
Donahoe D. MEMS roadmapping. ASME IMECE, New York, NY, November 2001.
Donahoe D. Electronics packaging. IEEE Utah Section Meeting, Roy, UT, June 2001.
Donahoe D. Compaq Seminar Series, Houston, TX and College Station, TX, 2000.
Donahoe D. Houston Hispanic Career and Education Forum, George R. Brown Convention Center, Houston, TX, January 2000.
Donahoe D. ASME IMCE, Presentation on Engineering Education, Nashville, TN, November 1999.
- Assistant Research Scientist, University of Maryland CALCE, 2002–2005
- Chief Technologist, Iomega, 2000–2002
- Principal Member Technical Staff, Compaq Computer, 1990–2000
- Section Manager, Teledyne, CME, 1989–1990
- Engineering Specialist, Ford Aerospace and Communications Corp., 1988–1990
- Senior Staff Engineer, Motorola, GEG, 1983–1988
- Senior Engineer, Lockheed Missiles and Space Co., 1979–1983
- Graduate Assistant, University of Illinois, 1977–1979
- Institute for Electrical and Electronics Engineers—IEEE (senior member)
- Materials Research Society—MRS (member)
- American Society of Mechanical Engineers—ASME (member)
- International Microelectronics and Packaging Society—IMAPS (member)
- Society of Petroleum Engineers—SPE (member)
- American Society for Quality—ASQ (senior member)
- Director, Silicon Valley Engineering Council—SVEC
–ASQ ECD Council (American Society for Quality, Electronics & Communications Division Council)
- Associate Editor for the IEEE Transactions on Components and Packaging Technologies
- Chairman for the IEEE Components and Packaging Society Santa Clara Chapter, 2007-2008
- Executive Committee IEEE San Francisco Bay Area Nanotechnology Council, 2008
- Chief Editor inaugural Silicon Valley Engineering Council for 2009 Engineers Week Journal
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- Ph.D., Mechanical Engineering, University of Maryland, 2005
- M.B.A., Business Administration, Santa Clara University, 1983
- M.S., Mechanical Engineering, University of Illinois, Urbana-Champaign, 1979
- B.S., General Engineering, University of Illinois, Urbana-Champaign, 1977
- Registered Professional Engineer, Arizona, #16068
- Registered Professional Engineer, California, #M 2126
- Certified Reliability Engineer, American Society for Quality, Certificate #6379
Provisional Patent Application No. 60/557,590: Method to Sort Capacitors by Electrode Type, March 20, 2004 (with S. Ganesan).
Provisional Patent Application No. 60/378,321: Method, System and Apparatus for Indoor and Outdoor Track and Field Split and Finish Times with Backup Features by Computer Vision, May 8, 2002.
U.S. Provisional Patent Application No. 60/359,749: Method, System and Apparatus for Competitive Swimming Split and Finish Times with Backup Features by Computer Vision, February 27, 2002.
Patent Application No. 20010036061: Apparatus for Liquid Cooling of Specific Computer Components, November 1, 2001 (with M. Gill).
Patent 6496367: Apparatus for Liquid Cooling of Specific Computer Components, December 17, 2002 (with M. Gill).
Patent 6333849: Apparatus for Liquid Cooling of Specific Computer Components, December 25, 2001 (with M. Gill).
Patent 5953211: Apparatus Including Heat Sink Structure for Removing Heat From a Printed Circuit Board, September 14, 1999 (with H. Mecredy III).
Patent 5808869: Method and Apparatus for Transferring Heat from a PCMCIA Card, September 15, 1998 (with E. Brod).
Patent 5793609: PCMCIA Card Heat Removal Apparatus and Methods, August 11, 1998 (with H. Mecredy III).
Patent 5757615: Liquid Cooled Computer Apparatus and Associated Methods, May 26, 1998 (with M. Gill).
Patent 5475563: PCMCIA Card Heat Removal Apparatus and Methods, December 12, 1995 (with H. Mecredy III).
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