PROJECT PROFILE - Polysilicon and Silicon Nitride Residual Stress

Quantify your thin film material properties across wafer surfaces.

Problem
A fabrication facility needed to determine how polysilicon and silicon nitride residual stresses varied from batch to batch and across a given wafer.

Exponent’s Solution
Exponent employed a CMOS-compatible technique to fabricate polysilicon or silicon nitride MEMS micromembranes from thin films deposited onto silicon wafers. We then mapped the in-plane residual stress and biaxial modulus across the wafer surfaces.

Outcome
Exponent produced a rapid, repeatable, CMOS-compatible technique to evaluate thin film mechanical properties.

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