THIN FILM MECHANICAL PROPERTIES
Residual stress, elastic modulus, and other properties
measured easily and accurately.
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Deflected micromembrane
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Exponent offers a new micromembrane technology to
measure thin film and coating properties. Mechanical properties
are mapped over wafers and surfaces as large as 50 in2,
addressing the needs of semiconductor; MEMS; industrial thin
films and coatings; hard films and coatings; medical device
and optical coatings industries.
Our proprietary technique allows mechanical property characterization
with accuracy and flexibility not provided by X-ray, wafer
curvature, or indentation techniques. The technique is CMOS-compatible
and can evaluate either whole wafers or small coated surfaces.
A wide variety of coatings can be evaluated, ranging from
metals to ceramics to polymers.
Imagine the possibilities ...
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Measure thin film and coating properties for materials
selection and development |
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Process development for thin film deposition parameters |
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Process monitoring and control for deposition uniformity
and batch consistency |
| Properties |
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residual stress |
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elastic modulus |
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yield strength |
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ultimate strength |
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metrology |
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creep |
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wear |
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| Materials |
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semiconductors and dielectrics:
silicon, germanium, silicon
nitride, gallium arsenide |
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polymers |
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metals |
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ceramics |
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diamond |
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biological films |
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foils |
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Wafer with array of micromembranes
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PROJECT PROFILE
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MEMS Testing and Reliability
| Thin Film Mechanical Properties | MEMS
Design
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