Ryan Birringer
Ryan Birringer, Ph.D., P.E.
Managing Engineer
Materials & Corrosion Engineering
  • Menlo Park

Dr. Birringer specializes in metallurgy and materials science with an emphasis on metallurgical failure analysis of industrial components, piping and pipelines, medical devices, fasteners, electronic components, and consumer products. His experience as a metallurgist includes metallographic analysis and fractographic examination of fracture, fatigue, and stress corrosion cracking in metals. He has worked in the Alloy Solidification Research Laboratory at the University of Wisconsin – Madison and has conducted research in the fabrication and elevated temperature stability of bulk metallic glasses and metastable phases as well as in the development of low-temperature eutectic bonding techniques.

Dr. Birringer has significant experience characterizing adhesive and cohesive properties of thin films and coatings, including environmentally assisted cracking or delamination. He has developed and used innovative methods for the characterization of fracture properties in materials used in a variety of emerging energy and nanoscience technologies, including photovoltaics, three dimensional integrated circuits, and copper interconnections. Dr. Birringer also has experience in thin film and bulk materials characterization using a variety of techniques including AR-XPS, AES, SEM, EDS, TOF-SIMS, and wafer curvature measurements.

Dr. Birringer has held academic appointments in the Department of Materials Science and Engineering at Stanford University, serving as a lecturer and instructor for the courses Microstructure and Mechanical Properties and Imperfections in Crystalline Solids. Additionally, he has served as a guest lecturer and course assistant for the Mechanical Properties of Materials course. Dr. Birringer has also held a postdoctoral position at Stanford University.

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Materials Science and Engineering, Stanford University, 2011
  • M.S., Materials Science and Engineering, Stanford University, 2008
  • B.S., Materials Science and Engineering, University of Wisconsin, Madison, 2004
  • Stanford Graduate Fellowship in Science and Engineering

    Applied Materials Corporation Graduate Fellowship

    Foundry Education Foundation Scholarship

LICENSES & CERTIFICATIONS

Licensed Mechanical Engineer, California, #37824

Publications

Crnogorac F, Pease FRW, Birringer RP, Dauskardt RH. Low-temperature Al-Ge bonding for 3D integration. Journal of Vacuum Science and Technology B 2012; 30:06FK01.

Birringer RP, Shaviv R, Besser PR, Dauskardt RH. Environmentally assisted debonding of copper / barrier interfaces. Acta Materialia 2012; 60:2219–2228.

Birringer RP. Adhesion and time-dependent fracture in integrated circuit technologies. Doctoral Dissertation, Stanford University, 2011.

Birringer RP, Shaviv R, Geiss RH, Read DT, Dauskardt RH. Effects of barrier composition and electroplating chemistry on adhesion and voiding in copper / dielectric diffusion barrier films. Journal of Applied Physics 2011; 110:044312.

Birringer RP, Chidester PJ, Dauskardt RH. High yield four-point bend thin film adhesion testing techniques. Engineering Fracture Mechanics 2011; 78:2390–2398.

Birringer RP, Lu C-H, Deal MD, Nishi Y, Dauskardt RH. Bilayer metal gate electrodes with tunable work function: Adhesion and interface characterization. Journal of Applied Physics 2010; 108:053704.

Lu C-H, Wong GMT, Birringer R, Deal MD, Clemens BM, Nishi Y. Bilayer metal gate electrodes with tunable work function: Mechanism and proposed model. Journal of Applied Physics 2010; 107:063710.

Conference Proceedings and Abstracts

Ganot GS, Birringer RP, James B. Failure analysis of bone plates and screws. 2014 ASM International Materials Science and Technology Meeting, Pittsburgh, PA, October 12–16, 2014.

Lemberg JA, Gibbs J, Birringer R, James B, Eiselstein L. Fire cracking of leaded and lead-free brasses for use in water, oil and gas applications. 2014 ASM International Materials Science and Technology Meeting, Pittsburgh, PA, October 12–16, 2014.

Birringer RP, Dauskardt RH. Interface adhesion and related device properties of ultra-thin Cu diffusion barrier and high-k / metal gate films. 2011 Materials Research Society Spring Meeting, San Francisco, CA, April 25–29, 2011.

Birringer R, Dauskardt R. High yield adhesion testing for ultra-thin diffusion barrier and high-k/metal gate films. 2010 Materials Research Society Spring Meeting, San Francisco, CA, April 5–9, 2010.

Birringer R, Shaviv R, Mountsier T, Reid J, Zhou J, Geiss RH, Read D, Dauskardt R. Adhesion, Cu voiding, and debonding kinetics of copper / dielectric diffusion barrier films. Advanced Metallization Conference 2009, Baltimore, MD, October 13–15, 2009.

Crnogorac F, Birringer R, Dauskardt R, Pease F. Aluminum-germanium eutectic bonding for 3D Integration, IEEE International Conference on 3D System Integration, San Francisco, CA, September 28–30, 2009.

Birringer R, Shaviv R, Geiss RH, Read D, Dauskardt R. Adhesion and debonding kinetics of Cu / barrier interfaces: Effects of chemistry, environment, temperature, and current density. The Minerals, Metals, and Materials Society 2009 Annual Meeting, San Francisco, CA, February 15–19, 2009.

Birringer R, Shaviv R, Dauskardt R. Effects of current density, environment, and temperature on adhesion and debonding kinetics of Cu / barrier interfaces. Advanced Metallization Conference 2008, San Diego, CA, September 23–25, 2008.

Birringer R, Dauskardt RH. Adhesion and debond growth rate kinetics in dielectric barrier film stacks. 2008 Materials Research Society Spring Meeting, San Francisco, CA, March 24–28, 2008.

Birringer R, Lu C-H, Nishi Y, Hung S, Miner G, MacWilliams K, Dauskardt RH. Adhesion of interfaces in ultra-thin film transistor gate structures. 2007 Materials Research Society Spring Meeting, San Francisco, CA, April 9–13, 2007.


Academic Appointments

Lecturer and Course Instructor, Microstructure and Mechanical Properties, Department of Materials Science and Engineering, Stanford University, Fall 2013

Lecturer and Course Instructor, Imperfections in Crystalline Solids, Department of Materials Science and Engineering, Stanford University, Winter 2012

Guest Lecturer and Course Assistant, Mechanical Properties of Materials, Department of Materials Science and Engineering, Stanford University, Winter 2010

Professional Affiliations

Materials Research Society—MRS

The Minerals, Metals & Materials Society—TMS

ASM International

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Materials Science and Engineering, Stanford University, 2011
  • M.S., Materials Science and Engineering, Stanford University, 2008
  • B.S., Materials Science and Engineering, University of Wisconsin, Madison, 2004
  • Stanford Graduate Fellowship in Science and Engineering

    Applied Materials Corporation Graduate Fellowship

    Foundry Education Foundation Scholarship

LICENSES & CERTIFICATIONS

Licensed Mechanical Engineer, California, #37824