Scott A. Schroeder, Ph.D.

Dr. Schroeder's areas of expertise include structural mechanics, powder metallurgy, rapid prototyping, mechanics of electronic packaging, metallic and ceramic composites, and creep-fatigue interactions. Dr. Schroeder also specializes in thermal/mechanical testing methods and procedures for advanced materials, elevated temperature and cryogenic environments, in situ electron microscopy deformation studies, fractography, and full-field strain mapping techniques. He has specialized experience in consumer product durability and design evaluation, motor bearing failures, heavy machinery, and mechanical design evaluation. Dr. Schroeder is also frequently called upon to perform failure analysis of components, devices, and equipment made from metals, plastics, glass, and ceramics.

Prior to joining Exponent, Dr. Schroeder was a Member of Technical Staff at Rockwell Scientific in the field of mechanics of materials and structural metals, where he conducted research on advanced aerospace composites. In addition, he developed test methodologies for surface mount reliability of microelectronics, and has developed experimental and mathematical models for material behavior. Dr. Schroeder holds 2 patents and has experience negotiating intellectual property issues. He was an instructor at Moorpark College in Moorpark, California.

Schroeder SA, Ryang H, Spurling R. Advances in direct metal fabrication. Advances in powder metallurgy and particulate materials. Proceedings, 2003 World Congress on Powder Metallurgy and Particulate Materials, Las Vegas, NV, June 2003.

Schroeder SA. Freeform fabrication of metallic components. Proceedings, 1st BCC Conference on Fine, Ultrafine, and Nano Particles, New York, NY, November 1998.

Liang J, Lee PS, Gollhardt N, Schroeder SA. Creep study for fatigue life assessment of solder joints of two lead-free high temperature solder alloys. Electronic Packaging Materials Science IX, MRS Fall Meeting, Boston, MA, 1996.

Liang J, Lee PS, Schroeder SA, Heinrich SM. An integrated fatigue life prediction methodology for optimum design and reliability assessment of solder interconnections. Advances in Electronic Packaging, ASME-EEP 1997; 19–2:1583–1592.

Liang J, Gollhardt N, Lee PS, Schroeder SA, Morris WL. A study of fatigue and creep behavior of four high temperature solders. Fatigue and Fracture of Engineering Materials and Structures 1996; 19–11:1401–1409.

Liang J, Gollhardt N, Lee PS, Schroeder SA, Morris WL. Fatigue and cyclic deformation behavior of high temperature solder alloys. Application of Experimental Mechanics to Electronic Packaging 1995; EEP-Vol. 13/AMD-Vol. 1214.

Heinrich SM, Shakya S, Wang Y, Lee PS, Schroeder SA. Improved yield and performance of ball-grid array packages: Design and processing guidelines for uniform and non-uniform arrays. IEEE Trans., Components, Packaging & Manufacturing Technology Society, Part B: Advanced Packaging, Vol. 19–2, May 1996.

Heinrich SM, Schaefer M, Schroeder SA, Lee PS. Prediction of solder joint geometries in array-type interconnects. Journal of Electronic Packaging, ASME 1996; 118(3):114–121, September.

Heinrich SM, Wang Y, Shakya S, Schroeder SA, Lee PS. Selection of design and process parameters for non-uniform ball-grid arrays. Advances in Electronic Packaging: Toward Failure-Free, Low-Cost Packaging, Vol. 1, ASME-EEP Vol. 10-1:273–288; presented at InterPack ‘95, Lahaina, HI, March 1995.

Heinrich SM, Schroeder SA, Lee PS. Prediction of solder joint geometries in array-type interconnects. Journal of Electronic Packaging, ASME 1995; 118–3:142–147.

Heinrich SM, Shakya S, Wang Y, Lee PS, Schroeder SA. Improved yield and performance of ball-grid array packages: Design and processing guidelines for uniform and non-uniform arrays. Proceedings, 45th Electronic Components and Technology Conference, Las Vegas, NV, May 1995. (Selected for “Outstanding Paper Award,” 2nd place, Poster Session).

Schroeder SA, Morris WL, Mitchell MR, James MR, A model for primary creep of 63Sn-37Pb solder. Fatigue of Electronic Materials, ASTM STP 1153, Schroeder SA and Mitchell MR (eds), American Society for Testing and Materials, Philadelphia, PA, 1994.

Heinrich SM, Schroeder SA, Lee PS. Prediction of solder joint geometries in multiple-bump arrays. Mechanics and Materials for Electronic Packaging: Volume 1, Design and Process Issues in Electronic Packaging, Chen, Nguyen, and Winterbottom (eds), ASME AMD-Vol. 195, pp. 11–22, 1994; presented at the 1994 International Mechanical Engineering Congress and Exposition, Chicago, IL, November 1994.

Schroeder SA, Mitchell MR. Torsional creep behavior of 63Sn-37Pb solder. Advances in Electronic Packaging, American Society of Mechanical Engineers, New York, NY, Vol. 2, pp. 649–653, 1992.

Enke NF, Kilinski TJ, Schroeder SA, Lesniak JK. Mechanical behaviors of 60/40 tin-lead solder lap joints. IEEE Trans. on Comp., Hybrids, and Manu. Tech 1989; 12(4):459–468, December.

Books

Schroeder SA, Mitchell MR (eds). Fatigue of Electronic Materials. American Society for Testing and Materials, STP 1153, 1994.

Technical Report

Artaki I, Noctor D, Desantis C, Desaulnier W, Felton L, Palmer M, Felty J, Greaves J, Handwerker C, Mather J, Napp D, Pan T.-Y, Rosser J, Schroeder SA, Vianco P, Whitten G, Zhu Y. Lead-free Solder Final Report. Final Report of NCMS Project No. 170502, August 1997.

Selected Invited Presentations

Schroeder SA, Guyer EP, O’Brien MJ. Fracture and fatigue behavior of Si3N4 balls, 2008 AFRL/RZTM Bearing Modeling Summit, August 2008.

Schroeder SA. Advances in direct metal fabricating. WESTEC, Society of Manufacturing Engineers, March 23, 2004.

Bulat W, Schroeder SA, Dadkhah MS. 3D induction heating simulation of a helical gear. ANSYS Conference, 1998.

Schroeder SA, Mitchell MR, Evans AG. Creep crack propagation of 63Sn/37Pb with emphasis on colony boundary deformation and rupture. TMS Annual Meeting, February 1997.

Schroeder SA. Reliability modeling for lead-free microelectronics. TMS Annual Meeting, Orlando, February 9–13, 1997.

Schroeder SA, Morris WL, Mitchell MR, Evans AG. In-situ field emission SEM creep testing of 63Sn/37Pb with emphasis on colony boundary deformation. VIII International Congress on Experimental Mechanics of the Society for Experimental Mechanics, Experimental/Numerical Mechanics in Electronic Packaging session, Nashville, TN June 10–13, 1996.

Schroeder SA, Morris WL, James MR. A microstructural based model of thermal fatigue damage in Pb/Sn alloy solder lap-joints. Lead-Free Solder Workshop, Northwestern University, July 24–26, 1995.

Schroeder SA, Morris WL, Mitchell MR, James MR. Modeling of fatigue damage of solder joints. ASTM Symposium on Fatigue of Electronic Materials, Atlanta, GA, May 17, 1993.

Schroeder SA, Mitchell MR, Morris WL, Dadkhah MS. Damage propagation and reliability in solder joints. SRI Briefing, June 23, 1992.

Schroeder SA, Mitchell MR. Morris WL. Dadkhah MS. Thermal-mechanical behavior of solder joints. University of California, Santa Barbara, CA, July 31, 1992.

Cox BN, Dadkhah MS, Inman RV, Morris WL, Schroeder SA. Mechanisms of compressive failure in woven composites and stitched laminates. Proceedings, 9th DoD/NASA/FAA Conference on Fibrous Composites in Structural Design. Soderquist JR, Neri LM, Bohon LH (eds), pp. 125–138, Lake Tahoe, NV, November 1991.

Schroeder SA, Mitchell MR. Torsional creep behavior of 63Sn-37Pb solder. American Society of Mechanical Engineers/Japanese Society of Mechanical Engineers, San Jose, CA, August 9, 1991.

Cox BN, Dadkhah MS, Inman RV, Mitchell MR, Morris WL, Schroeder SA. Micromechanics of fatigue in woven and stitched composites. Proceedings, 1st NASA Advanced Composites Technology Conference. Davis, Jr. JA, Bohon HL (eds), Seattle, WA, October–November 1990.

Schroeder SA, Mitchell MR, Morris WL, Dadkhah MS. Torsional cyclic shear stress-strain behavior of 63-37 Solder. 1st International Workshop on Materials and Mechanics Issues of Solder Alloy Applications, Santa Fe, NM, June 6–8, 1990.

• Member of Technical Staff, Research Scientist, Rockwell Scientific Company, 1999–2004
• Member of Technical Staff, Rockwell International Science Center, 1996–1999
• Substitute Instructor, Moorpark College, 1996
• Research Specialist, Rockwell International Science Center, 1996–1994
• Technical Specialist, Rockwell International Science Center, 1991–1994
• Senior Technical Associate, Rockwell International Science Center, 1989–1991
  

Managed a site investigation at a passenger railcar accident in California. The
structural damage and accident conditions were assessed.

Evaluated the design suitability of a pipe coupling used in a municipal water pumping station in San Diego, California. Determined the design loads and influence of the manufacturing process.

Managed design and safety reviews of a variety of consumer fitness equipment. Conducted reliability and safety testing for compliance with applicable US and international standards.

Managed and conducted experimental and analytical fatigue and fracture assessments of vehicle components and aerospace materials.

Managed an investigation to determine the scope of a medical device recall. Conducted numerical analyses to assess the viability of several design remediation options.

• American Society for Testing and Materials
  – Committee E28 on Mechanical Testing
  – Committee E08 on Fatigue and Fracture (Vice Chair E08.05.01 Fatigue of Materials)
  – Committee B09 on Metal Powders and Metal Powder Products
  – Committee F08 on Sports Equipment and Facilities
  – Past Chairman Fatigue of Electronic Materials
• American Society of Mechanical Engineers
• • American Society of Materials (Former Chair San Fernando Valley Chapter)
• The Minerals, Metals, and Materials Society