Mr. Wei has extensive experience in the area of silicon integrated circuit (IC) design, verification, and fabrication. His experience covers logic and embedded memory IC design, physical layout, and IC photo-mask production. He is also knowledgeable in areas related to electronics systems design and manufacturing, semiconductor manufacturing processes, IC packaging technology and device physics.
Prior to joining Exponent, Mr. Wei was a project leader at a major semiconductor company, where he had led the research and development work of several flash memory based IC devices such as Programmable Logic Devices (PLDs) and configuration memories for Field Programmable Gate Arrays (FPGAs). He had successfully produced several commercial IC products and also worked extensively on related customer or yield issues, such as Electrostatic Discharge (ESD) failures, noise problems, flash memory data retentions, etc.
At Exponent, Mr. Wei specializes in investigations of semiconductor component failures and reliability problems, such as ESD/latch up suceptability, Time Dependant Dielectric Breakdown (TDDB) lifetime, package moisture sensitivity, etc. In addition, he had conducted extensive investigations of failures related to other electronics components and Printed Circuit Boards (PCBs), such as capacitor failures, electrochemical migration, PCB propagating faults, etc. Mr. Wei had also conducted a number of product safety reviews on electronics products, performing tasks such as component stress level analysis, circuit board failure mode and effect analysis, and customized laboratory testing. He had also been involved in several intellectual property litigation cases related to semiconductor IC design and manufacturing.
Wei W. A PWB failure case study. CTIA Battery Registration Program Ad-Hoc Meeting, Menlo Park, CA, January 2007