Ray Huang
Ray K. Huang, Ph.D., P.E., CFEI
Principal Engineer
Electrical Engineering & Computer Science
Menlo Park

Dr. Huang's expertise is in consumer electronics hardware and software with specialty in product liability, safety, quality, compliance and reliability. He has worked in Europe, Asia, and North America advising industrial and legal clients with focus on devising strategic plans to address technical risk as well as intellectual property and due diligence of legacy and emerging technologies.

Dr. Huang has led complex investigations in the field of microelectronics, battery and energy storage systems and computer control systems with respect to the following applications:

  • Mobile devices
  • Wearable devices and technologies
  • AR/VR technologies
  • Data centers and servers
  • Solar panel and inverters
  • Power adapters and power supplies
  • Printed circuit boards
  • IoT and Smart Home appliances
  • Drone technologies
  • Cleanroom fabrication equipment
  • Automotive electronics and event data recorders
  • Displays and touch screens
  • Network and communication equipment
  • Credit card payment systems

Dr. Huang also has extensive experience in prototype validation and development, including hardware, software, and embedded systems. He has developed implantable Parylene MEMS platforms for retinal and neural prosthetic, pressure sensors and lab-on-a-chip applications, built custom air quality and environmental monitoring equipment, and developed algorithm for agricultural asset management.

Dr. Huang currently serves as a voting member on IEC and UL standards development committees and has presented in numerous IEEE, Insurance Adjuster and technical conferences. He has taught undergraduate and graduate level courses in areas such as Computer Instrument Design, Introduction to Sensors and Actuators, VLSI and ULSI Technology, and MEMS Technology and Devices.

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Electrical Engineering, California Institute of Technology (Caltech), 2011
  • M.S., Electrical Engineering, California Institute of Technology (Caltech), 2006
  • B.S., Electrical Engineering, Cornell University, 2005

LICENSES & CERTIFICATIONS

Licensed Professional Electrical Engineer, California, #20293

Certified Fire and Explosion Investigator (CFEI) in accordance with the National Association of Fire Investigators (NAFI) National Certification Board

Crash Data Retrieval (CDR) Technician Levels 1 and 2

LANGUAGES

  • Mandarin Chinese

Publications

McNulty J, Trenkle J, Huang R, Brown E. The role of tin plating in arc-induced damage of power supplies. Materials Science & Technology 2015.

Huang R, Sorini A, McNulty J. Quantitative solder inspection with computed tomography. 2014 ISPCE, San Jose, CA, May 2014.

Huang R, Nilsson S. Fuse selection criteria for safety applications. 2012 ISPCE, Portland, OR, November 2012.

Crane S, Huang R, Kislitsyn M. Root cause analysis of failed capacitors and the capacitor plague. 2012 MS&T, Pittsburgh, PA, October 2012.

Chang J, Huang R, Tai YC. High-density IC chip integration with Parylene pocket. 2011 IEEE NEMS Conference, Kaohsiung, Taiwan, 2011.

Chang J, Huang R, Tai YC. High-density 256-channel chip integration with flexible Parylene pocket. Transducer '11, Beijing, China, June 5-9, 2011.

Huang R, Tai YC. Flexible parylene-based 3-D coiled cable. 5th IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Xiamen, China, 2010.

Huang R, Tai YC. Parylene to silicon adhesion enhancement. 15th International Conference on Solid-State Sensors, Actuators and Microsystems, Denver, CO, 2009.

Huang R, Tai YC. Parylene-pocket chip integration. 22nd IEEE International Conference on Micro Electro Mechanical Systems, Sorrento, Italy, 2009.

Huang R, Pang C, Tai YC, Emken J, Ustun C, Andersen RA, Burdick JW. Integrated parylene-cabled silicon probes for neural prosthetics. 21st IEEE International Conference on Micro Electro Mechanical Systems, Tucson, AZ, 2008.

Huang R, Pang C, Tai YC, Emken J, Ustun C, Andersen RA. Parylene coated silicon probes for neural prosthesis. 3rd IEEE International Conference on Nano/Micro Engineered and Molecular Systems, Sanya, China, 2008.

Presentations

Huang R. Sensor data reliability and sensor risk management. Biological + Chemical Sensors Summit, La Jolla, CA, December 2016.

Huang R. Wearable products development: testing to minimize product liability and safety risks. Wearble TechCon, San Jose, CA, July 2016.

Huang R, Klopp R, McGoran B. Reliability of wearable data. Sports and Fitness Industry Association, May 2016.

Huang R. Electrical loss investigations and resolution. PLRB Regional Conference, Sacramento, CA, St. Louis, MO and Richmond, Virginia, 2016.

Huang R, et al. Failure analysis of electronic packaging. ASME Professional Development Seminar, Santa Clara, CA, April 2014.

Huang R, Tai YC. Chip integration with flexible parylene pocket. 5th International Conference on Microtechnologies in Medicine and Biology, Quebec City, Canada, 2009.

Rizzuto DS, Musallam S, Pang C, Huang R, Tai YC, Andersen RA. The Caltech Brain-Machine interface platform. Society for Neuroscience, Atlanta, Georgia, 2006.

Patents

U.S. Patent: Pocket-enabled chip assembly for implantable devices WO2010090706 A2 (Huang R, Tai YC).

Prior Experience

Research Assistant, Caltech Micromachining Laboratory, California Institute of Technology, 2005–2010

Intern, Hardware System Lab, Palo Alto Research Center, 2005

Intern, Corporate Marketing, Applied Materials, 2004

Professional Affiliations

Member of IEEE

Project Experience

Computer and Data Center Servers 

Failure and root cause analysis of:

  • Multi-layer printed circuit boards propagating arcing failure
  • Connector, wiring, traces and interconnector failure
  • Temperature control (thermistor) and safety mechanism (fuses, circuit breakers) evaluation
  • Data center power system analysis; component risk, reliability and rating evaluation and review
  • Circuit breaker fire investigation

Proactive Reliability, Quality, Safety and Compliance Risk Assessment

  • Wearable devices (Wrist, VR/AR, fabric)
  • Drone Technologies
  • Smart home appliances
  • Security cameras
  • Electric bicycles, scooters and other vehicles

Fabrication Technology

Due diligence of MEMS and Integrated Circuit (silicon) manufacturing technology

Failure and root cause analysis of:

  • Chemical vapor deposition systems (CVD)
  • Etching systems (RIE)
  • Lithography systems and metallization systems (Sputtering, E-Beam)
  • Memory chip fabrication technology intellectual property analysis

Electronic Components 

Failure and root cause analysis, and reliability testing of: Electrolytic, surface mount and high power capacitors.

  • Resistive, axial, radial fuses
  • Power switching FET and Diodes
  • Vibrating motors
  • Camera modules
  • LEDs (Light Emitting Diodes)
  • Connectors modules and cables
  • RFID communication
  • PCB/LCD/Display interconnect technology
  • BGA/Soldering failures and analysis

Battery Technologies

Failure and root cause analysis, as well as proactive reliability and quality assurance of: 

  • Batteries systems (battery cell, protection circuitry, appropriate for portable, wearable, and consumer electronics applications)
  • Large format batteries appropriate for automotive and aerospace applications.

Electrical Appliances

  • Power supplies failure analysis – filtering capacitor failure and conductive filament short circuit fault
  • Fire investigations of household appliances including rice cookers, coffee makers, power strips, etc.
  • Network adapter safety evaluations
  • Web/Conference camera systems
  • Cell phone failure analysis – LCD screen connectors, flexible cables and ACF failures and on-board electrical components
  • Alcohol monitoring devices
  • Magnetic field exposure assessment; Magnetic material characterization
  • Solar panels, equipment and infrastructures

Computer Software and System Memory

  • Vehicle electronics memory survivability and integrity analysis
  • Counterfeit RAM chip investigation and screening
  • Software package IP claim chart construction
  • Hardware/Software embedded system design review
    • Event data recorder
    • Electronic parking brake systems 
    • Battery management units

Intellectual Property

  • Infringement assessment, examination and testing, claim interpretation and prior art research

Biomedical Applications

  • Implantable device fabrication technology due diligence
  • Implantable hybrid cable failure analysis
  • Surgical tool electronics failure analysis
  • Glucose monitor circuitry failure analysis
  • Near-field communication and power transfer
  • Medical device and monitoring equipment

News & Events

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Electrical Engineering, California Institute of Technology (Caltech), 2011
  • M.S., Electrical Engineering, California Institute of Technology (Caltech), 2006
  • B.S., Electrical Engineering, Cornell University, 2005

LICENSES & CERTIFICATIONS

Licensed Professional Electrical Engineer, California, #20293

Certified Fire and Explosion Investigator (CFEI) in accordance with the National Association of Fire Investigators (NAFI) National Certification Board

Crash Data Retrieval (CDR) Technician Levels 1 and 2

LANGUAGES

  • Mandarin Chinese