Jared Schwartz
Jared Schwartz, Ph.D.
Associate
Polymer Science & Materials Chemistry
Atlanta

Dr. Schwartz’s expertise includes the synthesis and engineering of polymers and polymer formulations, photoactive compounds, light sensitizers, and cross-linking agents. He has specific knowledge in microelectronics packaging applications. His current research interests include self-immolative polymers, biodegradable plastics, photo-sensitive polymers, and sports textiles.

Dr. Schwartz’s background in microelectronics packaging includes the impact of small molecule additives on the mechanical, electrical, and lithographic performance of permanent, low-dielectric constant polymers. In addition, he has synthesized and characterized low ceiling temperature polyaldehyde copolymers for vaporizing sensors and sacrificial bracing.

He has extensive experience with characterization techniques for polymers, with specific expertise in low-dielectric constant polymers, template polymers, photodefinable materials, thin films, chemical amplification, and dissolution, including thermal gravimetric analysis (TGA), differential scanning calorimetry (DSC), nuclear magnetic resonance (NMR), gel permeation chromatography (GPC), scanning electron microscopy (SEM), Fourier transform infrared (FTIR) spectroscopy, and quartz crystal microbalance (QCM). Other characterization techniques with which he is experienced include mass spectrometry (MS), secondary ion mass spectrometry (SIMS), UV-visible spectrometry, tensilometry, variable angle spectroscopic ellipsometry (VASE), profilometry, and atomic force microscopy (AFM).

Prior to joining Exponent, Dr. Schwartz worked in the semiconductor industry in the fabrication of SiC transistors and diodes. His experience includes statistical process control, equipment inspections, cost minimization programs, and cycle time management.

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Chemical Engineering, Georgia Institute of Technology (Georgia Tech), 2017
  • B.S., Chemical Engineering, Mississippi State University, 2012, magna cum laude

Publications

Schwartz, J. M.; Phillips, O.; Engler, A.; Sutlief, A.; Lee, J.; Kohl, P. A. Stable, High-Molecular-Weight Poly(phthalaldehyde). J. Poly. Sci. A: Polym. Chem. 2016, 55, 1166–1172.

Uzunlar, E.; Schwartz, J.; Phillips, O.; Kohl, P. A. Decomposable and Template Polymers: Fundamentals and Applications. J. Electron. Packag. 2016, 138 (2), 020802.

Phillips, O.; Schwartz, J. M.; Kohl, P. A. Thermal Decomposition of Poly(Propylene Carbonate): End-capping, Additives, and Solvent Effects. Polym. Degrad. Stab. 2016, 125, 129–139.

Hayes, C. O.; Mueller, B. K.; Liu, P.; Bell, W. K.; Schwartz, J. M.; Thedford, R. P.; Kohl, P. A.; Willson, C. G. Directly Patternable Benzocyclobutene and Methacrylate Silsesquioxanes for Microelectronics Packaging. J. Ceram. Soc. Jpn. 2015, 123 (1441), 800-804.

Mueller, B. K.; Schwartz, J. M.; Sutlief, A. E.; Kohl, P. A. Improved Mechanical Properties of Chemically Amplified, Positive Tone, Polynorbornene Dielectric. ECS J. Solid State Sci. Technol. 2015, 4 (2), N6–N12.

Schwartz, J. M.; Mueller, B. K.; Elce, E.; Pritchard, Z. D.; Li, H. W.; Grillo, A. M.; Lee, S. Y.; Kohl, P. A. Positive Tone, Polynorbornene Dielectric Crosslinking. ECS J. Solid State Sci. Technol. 2014, 4 (1), N3008–N3014.

Mueller, B. K.; Schwartz, J. M.; Sutlief, A. E.; Bell, W. K.; Hayes, C. O.; Elce, E.; Grant Willson, C.; Kohl, P. A. Chemically Amplified, Positive Tone, Polynorbornene Dielectric for Microelectronics Packaging. ECS J. Solid State Sci. Technol. 2014, 4 (1), N3001–N3007.

Selected Presentations


Schwartz, J. M.; Phillips, O.; Engler, A.; Lee, J.; Sutlief, A.; Kohl, P. A. Stable, High Molecular Weight Polyaldehydes. 253rd American Chemical Society National Meeting & Exposition, San Francisco, California. April 2-6, 2017.

Schwartz, J. M.; Phillips, O.; Engler, A.; Kohl, P. A. Vaporizing Polymers: Synthesis, Stability, and Photo-sensitization. Monie A. Ferst Award Symposium in honor of C. Grant Willson. Atlanta, Georgia, November 2, 2016.

Patents

US Patent Application No. 15/494,949: Transient Adhesives, Methods of Making, and Methods of Use, filed April 24, 2017.

US Provisional Patent No. 62/464,664: Low Dielectric Constant, Porous Epoxy-Based Dielectric, filed February 28, 2017.

US Provisional Patent No. 62/429,440: Vaporizing and Fast Evaporating Self-immolative Polymers, filed December 2, 2016.

Prior Experience

Process Engineering Co-op, SemiSouth Laboratories, Fall 2009-Summer 2011

Computer Science Intern, Intergraph Corporation, Summer 2008

Knowledge

News & Events

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Chemical Engineering, Georgia Institute of Technology (Georgia Tech), 2017
  • B.S., Chemical Engineering, Mississippi State University, 2012, magna cum laude