Biocompatibility Packaging

The demand for better medical care accelerated the advancement of biomedical instrumentation, which includes an emphasis on preventative care, accuracy and minimally invasive procedures. As a result, the traditional wired sensor approach has quickly evolved into deployment and implantation of an entire electronic system in humans, which drove the advancement in biocompatibility packaging technologies and techniques.

The goal of achieving biocompatibility of implantable electronics involves prevention of material leaching from the device into the body, and of body fluids penetrating the device, which may cause corrosion, shorting, biofouling, or other adverse effects. Some devices, such as pacemakers or drug-delivery systems, may be wholly encapsulated with surface connectors, sensors or jettison ports.

Exponent’s biomedical electronics team has a wide range of experience manufacturing, designing and performing analysis this area, involving devices such as:

  • BioMEMs
    • Microvalves, Micropumps,
    • Electrochemical Sensors
    • Microactuators
    • Drug Delivery Systems
    • Lab-on-a-Chip
  • Pacemakers (leads and generators)
  • Implantable cardioverter-defibrillators (ICDs) (leads and generators)
  • Implantable electromagnetic transponders
  • Ocular devices
  • Battery cases
  • Electrodes and control units
  • Other printed circuit board units

Exponent also leverages its capability and knowledge in the traditional electronic assembly and packaging technologies and electronic systems into testing and evaluation of:

  • Power Systems
  • Battery Risk Analysis
  • Data Transmission
  • Power Powering
  • Radio Frequency (RF) Safety
  • Component Quality and Reliability

Working closely with our clients and interdisciplinary team members, our engineers have performed analysis and supported:

  • Field recalls
  • Intellectual property assessment
  • ISO 10993 biocompatibility standards compliance
  • Hardware and product design
  • Component placement and prototype consulting


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