- Ph.D., Materials Science and Engineering, Stanford University, 2019
- B.S., Materials Science and Engineering, University of Maryland, College Park, 2014
- IFSCC Applied Research Award, 32nd IFSCC Congress in London, UK, 2022
- 1st Prize in the ASM Undergraduate Design Competition, UMD College Park, 2014
- Dinah Berman Memorial Award, UMD College Park, 2013
Dr. Berkey is a materials engineer with expertise characterizing thin-film adhesion failure caused by mechanical damage and environmental degradation from sources like ultraviolet light, heat, and chemical species. His work spans biological and inorganic systems, specializing in biomechanical and chemical barrier properties of human skin as well as layered structures in electronic devices. He bridges the diversity in material systems with extensive experience in mechanical analysis techniques, adaptable experimental design, method development, and spectroscopies such as Fourier-transform infrared (FTIR) and Raman. His technical interests include wearable device technologies such as next-generation sensors or trans-dermal drug delivery systems, which lie at the thin-film interface of biological tissue and electronics.
Prior to joining Exponent, Dr. Berkey performed postdoctoral research at Stanford University where he prototyped thin, flexible adhesive armor appliques that reduced projectile impact injuries to the face and extremities. He designed IRB-approved human clinical trials to ensure applique prototypes maintained adhesion and user comfort during normal daily activities. Additionally, Dr. Berkey obtained his Ph.D. from Stanford University, where he developed a quantitative connection between commercial skin-care formulation penetration into the skin, consequently reduced biomechanical stress, and enhanced perceptions of comfort in product consumers.