- Ph.D., Mechanical Engineering, Hong Kong University of Science and Tech, 2017
- M.Sc., Mechanical Engineering, Hong Kong University of Science and Tech, 2012
- B.Eng., Mechanical Design, Shenyang Agricultural University, China, 2011
- Certified SOLIDWORKS Associate in Mechanical Design
- Outstanding Paper Award (1st Place) in International Conference of Electronic Packaging Technology (ICEPT) 2016, “Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering”.
- Journal of Electronic Packaging (JEP) reviewer of the year 2021 (Awarded at ASME InterPack 2021)
- IEEE Senior Member
- IEEE Electronic Packaging Society
- IEEE Product Safety Engineering Society
- Mandarin Chinese
Dr. Zhang has comprehensive experience in the development cycles and field-service cycles of consumer electronic products. On the macroscopic level, he is proficient in product safety and reliability regulation and compliance, involving regional requirements of North America, European Union, Britain, Asia, and China.
His expertise includes Design for Safety, Manufacturability, and Reliability (DFX) consulting on electronic products, including design and structure optimization and material selection, life-prediction of field service, harsh environmental assessment, durability testing, high-power safety involving high-power electrics and power adapters, reliability and quality control systems, process optimization and cost reduction, incident investigation, and reverse engineering.
Dr. Zhang is also an electronic packaging and PCBA specialist with over 10 years of training and industry experience. He has industry experience in design, manufacturing, testing, reliability engineering, stress and thermal analysis, failure analysis, and root cause analysis of electronic devices at the PCBA level and component level. His experience covers solder joint reliability, wave-soldering and surface mounting technology (SMT), inter-metallic compound (IMC) of Sn-Ag-Cu eutectic solder alloys, electrochemical migration and dendrite/whiskers/CAF growth, electronic architectures involving 2.5D/3D integration, ball grid array (BGA) and land grid array (LGA) packaging, package on package (PoP) integration, system in package (SiP), chip on board (CoB), fan-out and fan-in package, wafer-level packaging (WLP), redistribution layer (RDL), printed circuit board assembly (PCBA), pad finishing and plating, conformal coatings, backplate level assembly, solder paste and flux, discrete electronic components, LED, flexible printed circuit (FPC) , wire-bonding and interconnections, IPC/JEDEC/JEITA standards, USB-IF regulations, thermal interface material and thermal management, and adhesive bonding techniques.
Dr. Zhang has led many industrial projects involving industrial and household electronics, electronic packaging, and PCB/PCBA field, including compliance and regulation consulting, DFX inspection and review, Failure mode and effects analysis (FMEA) review, process optimization, quality control on mass production, cost reduction, thermo-mechanical coupling testing/simulation, and material characterization. He has years of factory experience in supporting the new product introduction (NPI) from prototype to ramp and mass-production. He has also provided factory audits and professional training courses to companies manufacturing electronic products and packaging. He also supported many cases of international litigation, arbitration, and patent dispute in the technical field.
Dr. Zhang is also proficient with mechanical and thermal finite element analysis (FEA) analysis, laboratory testing techniques including standard and customized mechanical and thermal testing, material characterization involving DMA/TMA/DSC/TGA, surface analytical techniques involving SEM/FIB/AFM/Optical Profiler, harsh environmental testing, and electrical testing.