Qiming Zhang

Qiming Zhang, Ph.D.

Senior Engineer
Mechanical Engineering
Hong Kong

Dr. Zhang is a mechanical engineer with several years of training and industry experience in electronic packaging. He has industry experience in design, manufacturing, testing, reliability engineering, stress and thermal analysis, failure analysis, and root cause analysis of consumer and industrial electronics. He is proficient in solder joint reliability, wave-soldering and surface mounting technology (SMT), inter-metallic compound (IMC) of Sn-Ag-Cu eutectic solder alloys, electrochemical migration and dendrite/whiskers/CAF growth, electronic architectures involving 2.5D/3D integration, ball grid array (BGA) and land grid array (LGA) packaging, package on package (PoP) integration, system in package (SiP), chip on board (CoB), fan-out and fan-in package, wafer level packaging (WLP), redistribution layer (RDL), printed circuit board assembly (PCBA), conformal coatings of electrical components, backplate level assembly, solder paste and flux, electronic components, LED, flexible substrate, wire-bonding and interconnections, IPC/JEDEC/JEITA standards, USB-IF regulations, high-power electrics and power adapters, thermal interface material and thermal management, glue bonding techniques, and quality, safety and incident investigations of consumer and industrial electronics.

Prior to joining Exponent, Dr. Zhang handled many industrial projects in the electronic packaging area, including process optimization, quality control on mass production, cost reduction, thermo-mechanical coupling testing/simulation, and material characterization. He has factory experience for new product introduction from prototype to ramp and mass-production. He has also provided factory audit and professional training courses to companies manufacturing the electronic products and packaging.

Dr. Zhang is also proficient with mechanical and thermal finite element analysis (FEA) analysis, laboratory testing techniques including mechanical and thermal testing, material characterization, surface analytical techniques, harsh environmental testing, electrical testing, plating and coating reliability of consumer products, life prediction and quality control systems.

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2017
  • M.Sc., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2012
  • B.Eng., Mechanical Design, Shenyang Agricultural University, CN, 2011
  • Outstanding Paper Award (1st Place) in International Conference of Electronic Packaging Technology (ICEPT) 2016, “Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering”.

LICENSES & CERTIFICATIONS

Certified SOLIDWORKS Associate (CSWA)

LANGUAGES

  • Mandarin
  • English

Publications

Zhang, Qiming, and S. W. Ricky Lee. "Assessment of Fatigue Induced Pad Cratering With a Universal Expression of Printed Circuit Board Fatigue Resistance." Journal of Electronic Packaging 142.2 (2020).

Zhang, Qiming, Nareg Sinenian, and Ray Huang. "Investigations on Electrolytic Capacitors to Improve Reliability under Assembly-Level Impact Conditions." 2019 20th International Conference on Electronic Packaging Technology (ICEPT). IEEE, 2019.

Q. Zhang, et al. "Correlation of Warpage Distribution with the Material Property Scattering for Warpage Range Prediction of PBGA Components." Journal of Electronic Packaging (Dec. 2018), 140(4).

Q. Zhang, et al. "Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components through the Correlation with Scattering in Material Properties." In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), pp. 718-723.

Q. Zhang, Jeffery C.C. Lo, and S.W. Ricky Lee, "Pad cratering based failure criterion for the life prediction of board level cyclic bending test." in 2017 IEEE 67rd Electronic Components and Technology Conference (ECTC), 2017, pp. 448-455.

Q. Zhang, Jeffery C.C. Lo, and S.W. Ricky Lee, "Modeling of residual strain in BGA-PCB assemblies for pad cratering control." Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th Intersociety Conference on. IEEE, 2017, pp. 1153-1160.

Q. Zhang, Jeffery C.C. Lo, and S.W. Ricky Lee, "Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering." Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. IEEE, 2016, pp. 1-6.

Q. Zhang et al, "Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation." Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th Intersociety Conference on. IEEE, 2016, pp. 1312-1319.

Q. Zhang et al, "Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays," in 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2013, pp. 1788-1793.

Q. Zhang et al, "Development of innovative cold pin pull test method for solder pad crater evaluation," in Electronic Materials and Packaging (EMAP), 2012 14th International Conference On, 2012, pp. 1-4.

F. Le, S.W. Ricky Lee, and Q. Zhang, "3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing." Journal of Micromechanics and Microengineering 27.4 (2017): 045012.

Q. Zhang (2017). Strain Dominant Failure Criteria for Board Level Pad Cratering under Over-stress and Fatigue Loading (Doctoral dissertation, Hong Kong University of Science and Technology).

Presentations

Invited Talk of Exponent Hong Kong 2019 One-Day Technical Seminar Series: Solving Multidisciplinary Consumer Product Development Challenges, “Reliability Engineering of Consumer and Industrial Electronics: From the Design, Manufacturing to Testing”.

Invited Talk of 2019 20th International Conference on Electronic Packaging Technology, "Investigations on Electrolytic Capacitor to Improve the Reliability under Assembly Level Impact Condition".

Invited Talk of Shenzhen Institutes of Advanced Technology (SIAT) at 2019 Mainland, Taiwan, Hong Kong and Macau Key Technology Forum of Electronic Packaging, “Failure Analysis of Consumer Electronics”.

Invited Talk of Huawei 2017 Technology Forum at Shanghai, “Strain Dominant Failure Criteria for Board Level Pad Cratering under Over-stress and Fatigue Loading”.

Invited Talk of The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2017, “Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control”.

Patents

“Cold Pin Pull Test Method for Pad Cratering Evaluation”, Chinese Patent. CN 103293099 A

Prior Experience

Senior Engineer I, Mechanical, Design Engineering, Artesyn Embedded Technologies, HK, 2017-2018.

Post-doctoral Researcher/Research and Teaching Assistant, Center of Advanced Microsystems Packaging, The Hong Kong University of Science & Technology, HK, 2013-2017.

Structural Engineer, Center Research Lab, Shenyang Machine Tool Co. Ltd., CN, 2012

Additional Information

Peer Reviewer

Reviewer of Journal of Electronic Packaging, American Society of Mechanical Engineers (ASME)

Knowledge

News & Events

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2017
  • M.Sc., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2012
  • B.Eng., Mechanical Design, Shenyang Agricultural University, CN, 2011
  • Outstanding Paper Award (1st Place) in International Conference of Electronic Packaging Technology (ICEPT) 2016, “Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering”.

LICENSES & CERTIFICATIONS

Certified SOLIDWORKS Associate (CSWA)

LANGUAGES

  • Mandarin
  • English