Qiming Zhang
Qiming Zhang, Ph.D.
Senior Engineer
Mechanical Engineering
Hong Kong

Dr. Zhang is a mechanical engineer with several years of training and industry experience in electronic packaging. He has industry experience in evaluation for reliability of consumer electronics, failure analysis, finite element analysis (FEA), and root cause analysis. He is also proficient in evaluation of solder joint reliability, surface mounting technology (SMT), inter-metallic compound (IMC) of Sn-Ag-Cu eutectic solder alloys, ball grid array (BGA) packaging, and electronic architectures involving 2.5D/3D integration.

Prior to joining Exponent, Dr. Zhang handled many industrial projects in the electronic packaging area, including the process optimization, quality control on mass production, cost reduction, thermo-mechanical coupling testing/simulation, and material characterization. He has factory experience for new product introduction from prototype to ramp and mass-production. He has also provided professional training courses to companies manufacturing electronic packaging.

Dr. Zhang is proficient with ANSYS Mechanical finite element analysis software, laboratory testing techniques, and quality control systems.

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2017
  • M.Sc., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2012
  • B.Eng., Mechanical Design, Shenyang Agricultural University, CN, 2011
  • Outstanding Paper Award (1st Place) in International Conference of Electronic Packaging Technology (ICEPT) 2016, “Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering”.

LANGUAGES

  • Mandarin
  • English

Publications

Q. Zhang, et al. "Correlation of Warpage Distribution with the Material Property Scattering for Warpage Range Prediction of PBGA Components." Journal of Electronic Packaging (Dec. 2018), 140(4).

Q. Zhang, et al. "Determination of a Meaningful Warpage Acceptance Criterion for Large PBGA Components through the Correlation with Scattering in Material Properties." In 2018 IEEE 68th Electronic Components and Technology Conference (ECTC), pp. 718-723.

Q. Zhang, Jeffery C.C. Lo, and S.W. Ricky Lee, "Pad cratering based failure criterion for the life prediction of board level cyclic bending test." in 2017 IEEE 67rd Electronic Components and Technology Conference (ECTC), 2017, pp. 448-455.

Q. Zhang, Jeffery C.C. Lo, and S.W. Ricky Lee, "Modeling of residual strain in BGA-PCB assemblies for pad cratering control." Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2017 16th Intersociety Conference on. IEEE, 2017, pp. 1153-1160.

Q. Zhang, Jeffery C.C. Lo, and S.W. Ricky Lee, "Correlation of board and joint level test methods with strain dominant failure criteria for improving the resistance to pad cratering." Electronic Packaging Technology (ICEPT), 2016 17th International Conference on. IEEE, 2016, pp. 1-6.

Q. Zhang et al, "Characterization of orthotropic CTE of BT substrate for PBGA warpage evaluation." Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2016 15th Intersociety Conference on. IEEE, 2016, pp. 1312-1319.

Q. Zhang et al, "Assessment of solder pad cratering strength using cold pin pull test method with pre-fabricated pin arrays," in 2013 IEEE 63rd Electronic Components and Technology Conference (ECTC), 2013, pp. 1788-1793.

Q. Zhang et al, "Development of innovative cold pin pull test method for solder pad crater evaluation," in Electronic Materials and Packaging (EMAP), 2012 14th International Conference On, 2012, pp. 1-4.

F. Le, S.W. Ricky Lee, and Q. Zhang, "3D chip stacking with through silicon-vias (TSVs) for vertical interconnect and underfill dispensing." Journal of Micromechanics and Microengineering 27.4 (2017): 045012.

Q. Zhang (2017). Strain Dominant Failure Criteria for Board Level Pad Cratering under Over-stress and Fatigue Loading (Doctoral dissertation, Hong Kong University of Science and Technology).

Presentations

Invited Talk of Huawei 2017 Technology Forum at Shanghai, “Strain Dominant Failure Criteria for Board Level Pad Cratering under Over-stress and Fatigue Loading”.

Invited Talk of The Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITHERM) 2017, “Modeling of Residual Strain in BGA-PCB Assemblies for Pad Cratering Control”.

Patents

“Cold Pin Pull Test Method for Pad Cratering Evaluation”, Chinese Patent. CN 103293099 A

Prior Experience

Senior Engineer I, Mechanical, Design Engineering, Artesyn Embedded Technologies, HK, 2017-2018.

Post-doctoral Researcher/Research and Teaching Assistant, Center of Advanced Microsystems Packaging, The Hong Kong University of Science & Technology, HK, 2013-2017.

Structural Engineer, Center Research Lab, Shenyang Machine Tool Co. Ltd., CN, 2012

CREDENTIALS & PROFESSIONAL HONORS

  • Ph.D., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2017
  • M.Sc., Mechanical Engineering, Hong Kong University of Science & Technology, China, 2012
  • B.Eng., Mechanical Design, Shenyang Agricultural University, CN, 2011
  • Outstanding Paper Award (1st Place) in International Conference of Electronic Packaging Technology (ICEPT) 2016, “Correlation of Board and Joint Level Test Methods with Strain Dominant Failure Criteria for Improving the Resistance to Pad Cratering”.

LANGUAGES

  • Mandarin
  • English